Fanless Embedded Box PC with 11th Generation Intel® Core™ SoC Processor
Specifications [BOXER-6643-TGU]
SYSTEM |
|
CPU |
Intel® Core™ i7-1185G7E |
CHIPSET |
Intel® SoC |
SYSTEM MEMORY |
DDR4 3200MHz SO-DIMM x 2, max 64GB |
DISPLAY INTERFACE |
HDMI 2.0 x 2 |
STORAGE DEVICE |
M.2 2280 M Key NVMe Slot x1 (PCIex4) |
ETHERNET |
RJ-45 x 2 for 1G/2.5GbE LAN (i219x1, i225x1) |
I/O |
HDMI 2.0 x 2 |
EXPANSION |
M.2 3052 B Key x 1 (for 5G module) |
INDICATOR |
Power / System LED |
OS SUPPORT |
Windows® 10 IoT 64-bit |
POWER SUPPLY |
|
POWER REQUIREMENT |
DC-in 9-36V x1 for 3-pin Terminal Block |
MECHANICAL |
|
MOUNTING |
Wallmount |
DIMENSIONS (W X H X D) |
9.84” x 5.62” x 2.03” (250 x 143 x 51.5) with bracket |
GROSS WEIGHT |
3.3 lb (1.5 kg) |
NET WEIGHT |
4.4 lb (2.0 kg) |
ENVIRONMENTAL |
|
OPERATING TEMPERATURE |
-4°F ~ 140°F (-20°C ~ 60°C), according to IEC68-2 with
0.5 m/s AirFlow (w/ Industrial wide Temp. SSD/RAM) |
STORAGE TEMPERATURE |
-40°F ~ 176°F (-40°C ~ 80°C) |
STORAGE HUMIDITY |
5 ~ 95% @ 40°C, non-condensing |
ANTI-VIBRATION |
3 Grms/ 5 ~ 500Hz/ operation (with SSD) |
ANTI-SHOCK |
50G, IEC 68-2-27, half sine, 11 ms duration (with SSD) |
CERTIFICATION |
CE/FCC class A |
Ordering Information [BOXER-6643-TGU]
PART NUMBER |
BOXER-6643-TGU-A1-1010 |
BOXER-6643-TGU-A2-1010 |
BOXER-6643-TGU-A3-1010 |
CPU |
Intel® Core™ i3-1115G4E |
Intel® Core™ i5-1145G7E |
Intel® Core™ i7-1185G7E |
LAN |
2 |
2 |
2 |
PCH |
Intel SoC |
Intel SoC |
Intel SoC |
USB |
USB 3.2 Gen2 x 3 |
USB 3.2 Gen2 x 3 |
USB 3.2 Gen2 x 3 |
RS232/422/485 |
2 |
2 |
2 |
STORAGE |
-M.2 2280 M Key NVMe Slot x1 (PCIex4) |
-M.2 2280 M Key NVMe Slot x1 (PCIex4) |
-M.2 2280 M Key NVMe Slot x1 (PCIex4) |
DISPLAY |
HDMI x 2 |
HDMI x 2 |
HDMI x 2 |
EXPANSION |
-M.2 3052 B Key x 1 (for 5G module) |
-M.2 3052 B Key x 1 (for 5G module) |
-M.2 3052 B Key x 1 (for 5G module) |
MOUNTING |
Wallmount |
Wallmount |
Wallmount |
POWER |
9~36V DC in |
9~36V DC in |
9~36V DC in |
OPERATION TEMP |
-4°F ~ 140°F (-20°C ~ 60°C), according to IEC68-2 with
0.5 m/s AirFlow (w/ Industrial wide Temp. SSD/RAM) |
-4°F ~ 140°F (-20°C ~ 60°C), according to IEC68-2 with
0.5 m/s AirFlow (w/ Industrial wide Temp. SSD/RAM) |
-4°F ~ 140°F (-20°C ~ 60°C), according to IEC68-2 with
0.5 m/s AirFlow (w/ Industrial wide Temp. SSD/RAM) |